Fabrication and electrical performance of Z-axis interconnections: An application of nano-micro-filled conducting adhesives

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 228-235

  Markovich, Voya R ^a   Das, Rabindra N ^a   Rowlands, Michael ^a   Lauffer, John ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; ELECTRICAL PERFORMANCE; ELECTRICALLY CONDUCTIVE ADHESIVES; LOW MELTING POINT ALLOY; MECHANICAL DRILLING; S-PARAMETER MEASUREMENTS; SINTERING MECHANISM; VOLUME RESISTIVITY;

CONDUCTING POLYMERS; DIELECTRIC MATERIALS; JOINING; LAMINATED COMPOSITES; LAMINATING; MICROELECTRONICS; OPTICAL MICROSCOPY; OPTIMIZATION; SCATTERING PARAMETERS; SINTERING; TENSILE STRENGTH;

ADHESIVES;

EID: 84876887471     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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