Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 995-1000

  Durairaj, R ^a   Mallik, S ^a   Marks, A ^a   Winter, M ^b   Bauer, R ^b   Ekere, N N ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

IDENTIFICATION (CONTROL SYSTEMS); MICROPROCESSOR CHIPS; RHEOLOGY; VISCOSITY;

SLUMP OCCURRING; STENCIL PRINT;

SOLDERING ALLOYS;

EID: 42549164567     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280132     Document Type: Conference Paper

References (10)

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4. Johnson, C.C. and Kevra, J. (1989) Solder Paste Technology: Principles and Applications, TAB Books Inc
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9. Riedlin M.H.A. (1998) Rheological characterisation of solder paste used in the stencil printing process, Phd Thesis, University of Salford.
10. Walters K. and Kemp R.A. (1969) In Polymer Systems, ed. R.E. Wetton and R.W. Whorlow, Macmillan, London, p.237.