Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Materials and Design

Volumn 30, Issue 10, 2009, Pages 4502-4506

  Mallik, S ^a   Ekere, N N ^a   Durairaj, R ^b   Marks, A E ^a   Seman, A ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING MATERIALS; ELECTRONIC PRODUCT; ELECTRONICS ASSEMBLY; ELECTRONICS MANUFACTURING; FLOW BEHAVIOURS; LEAD-FREE SOLDER PASTE; MINIATURISATION; NOVEL TECHNIQUES; OSCILLATORY MEASUREMENTS; REPULSIVE FORCES; RHEOLOGICAL BEHAVIOUR; RHEOLOGICAL MEASUREMENTS; ROUGHENED SURFACES; SERRATED SURFACES; SHEAR RATES; SLIP EFFECTS; SNAGCU SOLDER; SOLDER PARTICLES; SOLDER PASTE; SURFACE MOUNT COMPONENTS; WALL SLIP; WALL-SLIP EFFECTS;

BRAZING; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; GEOMETRY; RHEOLOGY; SHEAR DEFORMATION; SOLDERED JOINTS; STRATEGIC MATERIALS; SURFACE ROUGHNESS; SURFACES; VISCOSITY; VISCOSITY MEASUREMENT; WELDING;

LEAD;

EID: 67649401666     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.05.028     Document Type: Article

References (14)

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