Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application

2010 IEEE Nanotechnology Materials and Devices Conference, NMDC2010

Volumn , Issue , 2010, Pages 262-266

  Sinha, Arpita ^a   Mihailovic, Jadran A ^a   Morris, James E ^a   Lu, Hua ^b   Bailey, Chris ^b  

^a PORTLAND STATE UNIVERSITY   (United States)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

CNT Cu composite; CTE; Thermal conductivity

Indexed keywords

BULK PROPERTIES; CNT-CU COMPOSITE; COEFFICIENTS OF THERMAL EXPANSIONS; CTE; EFFECTIVE THERMAL CONDUCTIVITY; FINITE ELEMENT MODELS; THERMAL CONDUCTIVITY MODEL; THROUGH SILICON VIAS;

ABAQUS; CARBON NANOTUBES; ELECTRONICS PACKAGING; FILLED POLYMERS; FILLER METALS; FINITE ELEMENT METHOD; NANOTECHNOLOGY; SINGLE-WALLED CARBON NANOTUBES (SWCN); THERMAL CONDUCTIVITY; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS;

THERMAL EXPANSION;

EID: 78651477157     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NMDC.2010.5652157     Document Type: Conference Paper

References (11)

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