Microassembly of MEMS actuators and sensors via micro-masonry

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2013, Pages 283-286

  Zhang, Y ^a   Keum, H ^a   Kim, S ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT BONDING; MANIPULATION TOOLS; MECHANICAL SENSORS; MEMS ACTUATORS; MICRO ASSEMBLY; MICROFABRICATION PROCESS; SENSING AND ACTUATING; TRANSFER PRINTING;

MASONRY MATERIALS; MECHANICAL ACTUATORS; RAPID THERMAL ANNEALING; SENSORS;

MEMS;

EID: 84875466426     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2013.6474233     Document Type: Conference Paper

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