High performance and subambient silicon microchannel cooling

Journal of Heat Transfer

Volumn 129, Issue 8, 2007, Pages 1046-1051

  Colgan, E G ^a   Furman, B ^a   Gaynes, M ^a   LaBianca, N ^a   Magerlein, J H ^a   Polastre, R ^a   Bezama, R ^b   Marston, K ^b   Schmidt, R ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

High power density; Microchannel cooling; Single phase liquid cooling

Indexed keywords

COOLANTS; HEAT EXCHANGERS; HEAT RESISTANCE; INTERFACES (MATERIALS); TEMPERATURE;

HIGH POWER DENSITY; SILICON MICROCHANNEL COOLING; SINGLE PHASE LIQUID COOLING;

MICROCHANNELS;

COOLANTS; HEAT EXCHANGERS; HEAT RESISTANCE; INTERFACES (MATERIALS); MICROCHANNELS; TEMPERATURE;

EID: 35348838986     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2724850     Document Type: Conference Paper

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