High temperature breakdown strength and voltage endurance characterization of nanofilled polyamideimide

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 19, Issue 6, 2012, Pages 2090-2101

  Schadler, Linda S ^a   Nelson, J Keith ^a   Calebrese, Chris ^a   Travelpiece, Alisha ^a   Schweickart, Daniel ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

dielectric breakdown; Dielectric materials; polyamideimide; voltage endurance

Indexed keywords

AC BREAKDOWNS; BREAKDOWN STRENGTHS; CARRIER SCATTERING; CHARGE BUILDUP; EFFECTIVE PERMITTIVITY; ELEVATED TEMPERATURE; FILLER LOADING; FREQUENCY RANGES; HIGH TEMPERATURE; INTERFACIAL AREAS; MIXING RULES; NANO SCALE; NANOCOMPOSITE SYSTEMS; PRIMARY MECHANISM; PULSED ELECTRO ACOUSTICS; ROOM TEMPERATURE; SYSTEMATIC CHANGES; TWISTED WIRE; VOLTAGE ENDURANCE;

ALUMINA; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; FILLERS; NANOCOMPOSITES; NANOPARTICLES; PERMITTIVITY; POLYAMIDEIMIDES; SILICA;

LOADING;

EID: 84872141636     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2012.6396969     Document Type: Article

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