Breakdown voltage of thermoplastics with clay nanometer-sized fillers

Proceedings of the 2008 IEEE International Power Modulators and High Voltage Conference, PMHVC

Volumn , Issue , 2008, Pages 287-290

  Brandstetter, Stephen S ^a   Drummy, Lawrence F ^a   Horwath, John C ^b   Schweickart, Daniel L ^b   Vaia, Richard A ^b  

^a UES INC   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED VOLTAGES; BREAK DOWN VOLTAGES; BREAKDOWN STRENGTHS; CYLINDRICAL RODS; DETRIMENTAL EFFECTS; DIELECTRIC BREAKDOWN VOLTAGES; DIELECTRIC CHARACTERISTICS; DIELECTRIC STRENGTHS; ELECTRICAL CONDUCTIVITIES; HEAT DISTORTION TEMPERATURES; LOW-DENSITY POLYETHYLENES; NANO CLAYS; NANO FILLERS; NANOSCALE DISPERSIONS; NYLON-6; ORGANICALLY MODIFIED MONTMORILLONITES; PHYSICAL PROPERTIES OF POLYMERS; RAW MATERIAL COSTS; ROUNDED EDGES; THERMOPLASTIC POLYMERS; VINYL ACETATE COPOLYMERS;

CARBON BLACK; CLAY MINERALS; CONDUCTING POLYMERS; DC GENERATORS; DIELECTRIC LOSSES; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY; FILLERS; IONIZATION OF GASES; MECHANICAL PROPERTIES; MICA; MOSFET DEVICES; NYLON POLYMERS; POLYMERS; REINFORCED PLASTICS; SILICATE MINERALS; THERMOGRAVIMETRIC ANALYSIS; THERMOPLASTICS; TRANSMISSION ELECTRON MICROSCOPY;

POLYVINYL ACETATES;

EID: 62949226939     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPMC.2008.4743638     Document Type: Conference Paper

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