Surface degradation of polyamide nanocomposites caused by partial discharges using IEC (b) electrodes

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 11, Issue 5, 2004, Pages 833-839

  Kozako, Masahiro ^a   Fuse, Norikazu ^a   Ohki, Yoshimichi ^a   Okamoto, Tatsuki ^b   Tanaka, Toshikatsu ^a  

^a WASEDA UNIVERSITY   (Japan)

^b CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY   (Japan)

Author keywords

Electrical insulation; Partial discharges; Polyamide nanocomposite; Surface degradation

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTALLINE MATERIALS; DEGRADATION; ELECTRIC INSULATION; ELECTRODES; NANOSTRUCTURED MATERIALS; PARTIAL DISCHARGES; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

ENGINEERING MATERIALS; NANOFILLERS; POLYAMIDE NANOCOMPOSITE; SURFACE DEGRADATION;

POLYAMIDES;

EID: 9144244433     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2004.1349788     Document Type: Conference Paper

References (17)

1. Y. Kojima, A. Usuki, M. Kawasumi, A. Okada, Y. Fukushima, T. Kurauchi, and O. Kamigaito, "Mechanical Properties of Nylon 6-Cray Hybrid", J. Material Research, Vol. 8, pp. 1185-1189, 1993.
2. T. J. Lewis, "Nanometric Dielectrics", IEEE Trans. Dielectr. Electr. Insul., Vol. 1, pp. 812-825, 1994.
3. M. F. Frechette, M. Trudeau, H. D. Alamdari, and S. Boily, "Introductory Remarks on NanoDielectrics",IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), Kitchener, pp. 92-99, 2001.
4. P. C. Irwin and Y. Cao, "The Electrical Conduction in Polyimides Nanocomposites", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), Albuquerque, pp. 116-119, 2003.
5. C. Zilg, D. Kaempfer, R. Muelhaupt, and G.C. Montanari, "Electrical Properties of Polymer Nanocomposites based upon Organophilic Layered Silicates", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), Albuquerque, pp. 546-550, 2003.
6. 2 Nanocomposites", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), Albuquerque, pp. 719-722, 2003.
7. L. Lan, X. Wen, D. Cai, and H. Liu, "Study of the Properties of RTV Nanocomposite Coatings", Proc. 13th Intern. Sympos. High Voltage Engineering (ISH), Delft, pp. 1-4, 2003.
8. 2", Proc. 7th Intern. Conf. Properties and Applications of Dielectric Materials (ICPADM), Nagoya, pp. 913-916, 2003.
9. M. Y. Zhang, C. Yan, F. Yong, and Q. Q. Lei, "Synthesis and Characterization of Corona-resistant Nanocluster-trapped Polyimide/Silica Composites", Proc. 7th Intern. Conf. Properties and Applications of Dielectric Materials (ICPADM), Nagoya, pp. 753-756, 2003.
10. P. Zhang, W. Zhang, Y. Liu, Y. Fan, and Q. Lei, "Study on Corona-Resistance of Polyimide-Nano Inorganic Composites", Proc. 7th Intern. Conf. Properties and Applications of Dielectric Materials (ICPADM), Nagoya, pp. 1138-1141, 2003.
11. T. Imai, Y. Hirano, H. Hirai, S. Kojima and T. Shimizu, "Preparation and Properties of Epoxy-Organically Modified Layered Silicate Nanocomposites", IEEE Intern. Sympos. Electr. Insul. (ISEI), Boston, pp. 379-383, 2002.
12. K. Yasue, K. Kojima and S. Katahira, "Properties and Application of Nylon Nanocomposite", Magazine of Plastics, Vol. 47, No. 6, pp. 100-104, 1996 [in Japanese].
13. A. Usuki, A. Koiwai, Y. Kojima, M. Kawasumi, A. Okada, T. Kurauchi, and O. Kamigaito, "Interaction of Nylon 6-Clay Surface and Mechanical Properties of Nylon 6-Clay Hybrid", J. Appl. Polymer Sci., Vol. 55, pp. 119-123, 1995.
14. M. Kozako, N. Fuse, K. Shibata, N. Hirai, Y. Ohki, T. Okamoto and T. Tanaka, "Surface Change of Polyamide Nanocomposite Caused by Partial Discharges", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), Albuquerque, pp. 75-78, 2003.
15. O. Fukumoto, Handbook of Polyamide Resin, Nikkan Kogyo Shinbun LTD., 1988 [in Japanese].
16. K. Fujimoto, M. Yoshikawa, S. Katahira and K. Yasue, "Crystal Structure of Nylon 6 / Inorganic Layered Nanocomposite Film", Kobunshi Ronbunshu, Vol. 57, No. 7, 2000 [in Japanese].
17. S. Murase, A. Inoue, Y. Miyashita, N. Kimura, and Y. Nishino, "Structural Characteristics and Moisture Sorption Behavior of Nylon-6/Clay Hybrid Films", J. Polymer Sci.: Part B, Vol. 40, pp. 479-487, 2002.