Dielectric and thermal properties of polyamide-imide (PAI) films

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

Volumn , Issue , 2009, Pages 482-485

  Diaham, S ^a,b   Locatelli, M L ^a,b   Lebey, T ^a,b   Dinculescu, S ^a,b  

^a d'Hydraulique et des Telecommunications   (France)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND DIELECTRIC RELAXATION SPECTROSCOPY; CHARACTERISTIC TEMPERATURE; DC CONDUCTIVITY; DIELECTRIC PARAMETERS; ELECTRICAL PROPERTY; GLASS TRANSITION PHENOMENA; GLASS TRANSITION TEMPERATURE; HIGH TEMPERATURE; LOSS FACTOR; ORDERS OF MAGNITUDE; THERMAL PROPERTIES; WIDE-BAND-GAP SEMICONDUCTOR;

DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; GLASS; PERMITTIVITY; POLYAMIDEIMIDES; POLYIMIDES; SEMICONDUCTOR DEVICES; SPECTROSCOPY; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMODYNAMIC PROPERTIES;

GLASS TRANSITION;

EID: 77949307847     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2009.5377778     Document Type: Conference Paper

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