Variation in diffusion-induced solidification rate of liquated Ni-Cr-B insert during TLP bonding of Waspaloy superalloy

Materials Science and Engineering: A

Volumn 477, Issue 1-2, 2008, Pages 311-318

  Tokoro, K ^a   Wikstrom, N P ^a   Ojo, O A ^a   Chaturvedi, M C ^a  

^a UNIVERSITY OF MANITOBA   (Canada)

Author keywords

Brazing; Nikel base superalloy; Transient liquid phase joining

Indexed keywords

BONDING; EUTECTICS; HIGH TEMPERATURE PROPERTIES; PHASE INTERFACES; SOLIDIFICATION; SUPERALLOYS;

DIFFUSION-INDUCED SOLIDIFICATION; TRANSIENT LIQUID PHASE (TLP); TRANSIENT LIQUID PHASE JOINING; WASPALOY SUPERALLOY;

NICKEL ALLOYS;

BONDING; EUTECTICS; HIGH TEMPERATURE PROPERTIES; NICKEL ALLOYS; PHASE INTERFACES; SOLIDIFICATION; SUPERALLOYS;

EID: 39149101441     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.05.069     Document Type: Article

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