Reliability investigation of nano-enhanced thermal conductive adhesives

Proceedings of the IEEE Conference on Nanotechnology

Volumn , Issue , 2012, Pages

  Wang, Nan ^a   Murugesan, Murali ^a   Ye, Lilei ^b   Carlberg, Bjorn ^a   Chen, Si ^a,c   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHT SMART HIGH TECH AB   (Sweden)

^c School of Mechatronics and Mechanical Engineering   (China)

Author keywords

Electroless plating; Nanoparticles; Silicon carbide; Silver coating; Thermal conductive adhesive; Thermal conductivity

Indexed keywords

CARBIDE NANOPARTICLES; CONDUCTIVE ADHESIVE; DIE-ATTACH APPLICATIONS; RELIABILITY INVESTIGATIONS; SILVER COATINGS;

ELECTROLESS PLATING; NANOPARTICLES; NANOTECHNOLOGY; SILICON CARBIDE; SILVER PLATING; THERMAL CONDUCTIVITY;

SILVER;

EID: 84869161568     PISSN: 19449399     EISSN: 19449380     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2012.6322137     Document Type: Conference Paper

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