The effect of modulus on the performance of thermal conductive adhesives

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 648-651

  Hu, Zhili ^a,b   Yue, Cong ^a,c   Guo, Xingming ^a   Liu, Johan ^a,b,d  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SMIT Ltd Co   (China)

^d SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; CONTACT AREAS; FILLER PARTICLES; HIGH STIFFNESS; LINEAR SHRINKAGE; LOW SHRINKAGE;

ADHESIVES; ELECTRONICS PACKAGING; FILLERS; PACKAGING; SHRINKAGE; SILICON CARBIDE; STIFFNESS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

SILVER;

EID: 78449294497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582884     Document Type: Conference Paper

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