Reliability study for high temperature stable conductive adhesives

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10

Volumn , Issue , 2010, Pages 74-77

  Tao, Wenkai ^a   Chen, Si ^a,b   Berggren, Pär ^c   Liu, Johan ^a,d  

^a SHANGHAI UNIVERSITY   (China)

^b SMIT Ltd Co   (China)

^c SHT SMART HIGH TECH AB   (Sweden)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Contact resistance; Humidity; Isotropic conductive adhesives

Indexed keywords

CONDUCTIVE ADHESIVE; CURING BEHAVIOR; DECOMPOSITION BEHAVIORS; DIFFERENTIAL SCANNING CALORIMETERS; DYNAMIC MECHANICAL ANALYZER; ELECTRICAL RESISTANCES; ELECTRONIC PACKAGING; ENVIRONMENT CONTAMINATION; FINE-PITCH CAPABILITY; GLASS TRANSITION TEMPERATURE; HIGH TEMPERATURE; HUMIDITY; HUMIDITY TESTS; ISOTROPIC CONDUCTIVE ADHESIVES; LOW PROCESSING TEMPERATURE; MATRIX; MOISTURE RESISTANCE; STORAGE MODULI;

ADHESIVES; CONTACT RESISTANCE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; GLASS TRANSITION; HEMODYNAMICS; INDEPENDENT COMPONENT ANALYSIS; JOINING; MECHANICAL PROPERTIES; MOISTURE; PACKAGING; PEOPLE MOVERS; PROCESSING; THERMOGRAVIMETRIC ANALYSIS;

PACKAGING MATERIALS;

EID: 77952348796     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2010.5441378     Document Type: Conference Paper

References (6)

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2. Daoqiang Lu and C.P. Wong, "High Performance Conductive Adhesives Filled with Silver Coated Carbon Nanotubes," IEEE Trans on Electronics Packaging and Manufacturing, Vol.22, No.4 (1999), pp. 324-329.
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5. Masahiro Inoue and Johan Liu, "Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder," Proc. Electronics System-Integration Technology Corf, Greenwich, UK, Sept. 2008, pp.1147-1152.
6. Roger S. Rorgren and Johan Liu, "Reliability Assessment of Isotropically Conductive Adhesive Joints in Surface Mount Applications," IEEE Trans-CPMT, Vol.18, No.2 (1995), pp. 305-312.