Eutectic and solid-state wafer bonding of silicon with gold

Materials Science and Engineering: B

Volumn 177, Issue 20, 2012, Pages 1748-1758

  Abouie, Maryam ^a   Liu, Qi ^a   Ivey, Douglas G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Amorphous Si; AuSi; Crystalline Si; Eutectic bonding; Solid state bonding; Wafer bonding

Indexed keywords

AMORPHOUS SILICON; CRYSTALLINE MATERIALS; EUTECTICS; GOLD; GOLD ALLOYS; GOLD COMPOUNDS; GOLD DEPOSITS; SILICON COMPOUNDS; SILICON WAFERS;

AMORPHOUS SI; AMORPHOUS SILICON LAYERS; CRYSTALLINE SI; CRYSTALLINE SILICONS; EUTECTIC BONDING; NON-UNIFORM; SHEARS STRENGTH; SI WAFER; SIMPLE++; SOLID STATE BONDING;

WAFER BONDING;

EID: 84868206434     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2012.09.005     Document Type: Article

References (25)

1. C. Harendt, H.G. Graf, B. Hofflinger, and E. Penteker Journal of Micromechanics and Microengineering 2 1992 113 116
2. P.W. Barth Sensors and Actuators A 23 1990 919 926
3. J. Wei, H. Xie, M.L. Nai, C.K. Wong, and L.C. Lee Journal of Micromechanics and Microengineering 13 2003 217 222
4. C. Lee Sensors and Actuators A 85 2000 330 334
5. F. Niklaus, G. Stemme, J.Q. Lu, and R.J. Gutmann Journal of Applied Physics 99 2006 031101 031128
6. G.-S. Park, Y.-K. Kim, K.-K. Paek, J.-S. Kim, J.-H. Lee, and B.-K. Ju Electrochemical and Solid-State Letters 8 12 2005 G330 G332
7. R.F. Wolffenbuttel, and K.D. Wise Sensors and Actuators A 43 1994 22 29
8. Y.C. Lin, M. Baum, M. Haubold, J. Fromel, M. Wiemer, T. Gessner, and M. Esashi Actuators and Microsystems Conference 2009 244 247
9. E. Jing, B. Xiong, and Y. Wang Journal of Micromechanics and Microengineering 20 2010 095014 095020
10. S. Lani, A. Bosseboeuf, O. Garel, F. Parrain, N. Isac, D. Bouville, and X. Leroux ECS Transactions 16 2008 147 154
11. S. Chen, M. Chen, X. Yi, H. Zhang, and S. Liu Fifth International Conference on Electronic Packaging Technology ICEPT Proceedings 2003 187 189
12. D.D. Evans, and Z. Bok AuSi and AuSn Eutectic Die Attach Case Studies from Small (12 mil) to Large (453 mil) Die 2010 IMAPS - International Microelectronics And Packaging Society Carlsbad, USA
13. A.L. Tiensuu, M. Bexell, J.A. Schweitz, L. Smith, and S. Johansson Sensors and Actuators A 45 1994 227 236
14. R.F. Wohenbuttel, and K.D. Wise Sensors and Actuators A 43 1994 223 229
15. P.H. Chen, C.L. Lin, and C.Y. Liu Applied Physics Letters 90 2007 132120 132123
16. Y.C. Lin, M. Baum, M. Haubold, J. Frömel, M. Wiemer, T. Gessner, and M. Esashi Transducers 2009 244 247
17. S. Lani, A. Bosseboeuf, B. Belier, C. Clerc, C. Gousset, and J. Aubert Microsystem Technologies 12 2006 1021 1025
18. V. Dragoi, E. Cakmak, and E. Pabo Materials Research Society Symposia Proceedings 2009 1139 1145
19. J.H. Gillard, M. Graves, T. Hatsukami, and C. Yuan Carotid Disease: The Role of Imaging in Diagnosis and Management 2006 Cambridge University Press Cambridge, UK
20. M. Scholz, M. Gjukic, and M. Stutzmann Applied Physics Letters 94 2009 012108 012111
21. W. Knaepen, S. Gaudet, C. Detavernier, R.L. Van Meirhaeghe, J.J. Sweet, and C. Lavoie Journal of Applied Physics 105 2009 083532 083537
22. A. Hiraki Journal of the Electrochemical Society I27 1980 2662 2665
23. L. Calcagno, S.U. Campisano, and S. Coff Journal of Applied Physics 66 1989 1874 1877
24. S. Gall, J. Schneider, J. Klein, K. Huebener, M. Muske, B. Rau, E. Conrad, I. Sieber, K. Petter, K. Lips, M. Stoger-Pollach, P. Schattschneider, and W. Fuhs Thin Solid Films 511 2006 945 948
25. C. Yeh, K. Yang, H. Lee, and A.T. Wu Journal of Electronic Materials 41 2012 1796 1805