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Volumn 16, Issue 8, 2009, Pages 147-154

Multilayer Au-Si eutectic wafer bonding with microstructured sealing rings

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; EUTECTICS; GLASS; GLASS BONDING; GOLD COMPOUNDS; GOLD DEPOSITS; LIQUIDS; MICROSTRUCTURE; SEALS; SILICON COMPOUNDS; SILICON WAFERS;

EID: 63149131461     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2982864     Document Type: Conference Paper
Times cited : (3)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.