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Volumn 16, Issue 8, 2009, Pages 147-154
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Multilayer Au-Si eutectic wafer bonding with microstructured sealing rings
a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
EUTECTICS;
GLASS;
GLASS BONDING;
GOLD COMPOUNDS;
GOLD DEPOSITS;
LIQUIDS;
MICROSTRUCTURE;
SEALS;
SILICON COMPOUNDS;
SILICON WAFERS;
BONDING STRENGTH;
EUTECTIC BONDING;
EUTECTIC LIQUID PHASE;
LIQUID PHASE;
SEALING RING;
SI WAFER;
WAFER LEVEL PACKAGING;
WAFER BONDING;
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EID: 63149131461
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.2982864 Document Type: Conference Paper |
Times cited : (3)
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References (6)
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