Synthesis of Au-Sn alloy nanoparticles for lead-free electronics with unique combination of low and high melting temperatures

Microelectronics Reliability

Volumn 52, Issue 11, 2012, Pages 2685-2689

  Tabatabaei, Salomeh ^a   Kumar, Ashavani ^a   Ardebili, Haleh ^b   Loos, Peter J ^a   Ajayan, Pulickel M ^a  

^a Rice University   (United States)

^b UNIVERSITY OF HOUSTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AU-SN ALLOY; BULK STATE; CHEMICAL REDUCTION; CHEMICAL REDUCTION METHODS; ELECTRONIC COMPONENT; EUTECTIC POINTS; HEXAGONAL STRUCTURES; HIGH-TEMPERATURE ELECTRONICS; LEAD FREE ELECTRONICS; LEAD-FREE SOLDERING; MANUFACTURING PROCESS; MECHANICAL PERFORMANCE; MELTING TRANSITIONS; NANOSCALE RANGES; ROOM TEMPERATURE; SIZE RANGES; SOLDER ALLOYS; SOLDER JOINTS; SYNTHESIS METHOD;

ALLOYS; HIGH TEMPERATURE APPLICATIONS; MECHANICAL PROPERTIES; MELTING POINT; MILITARY APPLICATIONS; NANOPARTICLES; SOLDERING; SYNTHESIS (CHEMICAL); TIN; TIN ALLOYS; X RAY DIFFRACTION;

GOLD;

EID: 84867583194     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.04.008     Document Type: Article

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