Recent advances in the synthesis of lead-free solder nanoparticle

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 915-921

  Andersson, Cristina ^a   Zou, Changdong ^b   Yang, Bin ^b   Gao, Yulai ^b   Liu, Johan ^a,b   Zhai, Qijie ^b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; FREE VOLUME; LEAD; MECHANICAL PROPERTIES; MELTING; METAL MELTING; METALLIC COMPOUNDS; NANOPARTICLES; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SURFACE CHEMISTRY; SURFACE TENSION; TECHNOLOGY TRANSFER; WELDING;

ALL OVER THE WORLDS; BOTTOM-UP; ELECTRONICS PRODUCTIONS; EXTRAORDINARY PROPERTIES; HIGH MELTING; LARGE SURFACE AREAS; LATEST DEVELOPMENTS; LEAD-FREE SOLDERS; LOW MELTING POINTS; MELTING TEMPERATURES; NANOMETER RANGES; PER UNIT VOLUMES; POTENTIAL SOLUTIONS; QUANTUM SIZE EFFECTS; REFLOW TEMPERATURES; RESEARCH GROUPS; SIZE RANGES; SOLDER ALLOYS; SOLDER JOINTS; SURFACE ENERGIES; SYNTHESIS OF; TECHNOLOGICAL COMMUNITIES; TOP DOWNS;

MELTING POINT;

EID: 58149103701     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684474     Document Type: Conference Paper

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