Yield stress influenced by the ratio of wire diameter to grain size - A competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires

Philosophical Magazine

Volumn 92, Issue 25-27, 2012, Pages 3243-3256

  Yang, B ^a,b   Motz, C ^b   Rester, M ^c   Dehm, G ^b,c  

^a MATERIALS CENTER LEOBEN FORSCHUNG GMBH   (Austria)

^b ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^c UNIVERSITY OF LEOBEN   (Austria)

Author keywords

copper; Hall Petch behavior; micromechanics; size effect; tensile testing

Indexed keywords

FREE SURFACES; GRAIN SIZE; HALL-PETCH BEHAVIOR; MICROSTRUCTURE EVOLUTIONS; POLYCRYSTALLINE COPPER; SIZE EFFECTS; STRENGTHENING EFFECT; STRESS VALUES; TENSILE BEHAVIORS; WIRE DIAMETER;

COPPER; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MICROMECHANICS; MICROSTRUCTURE; TENSILE TESTING; YIELD STRESS;

WIRE;

EID: 84867045831     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786435.2012.693215     Document Type: Conference Paper

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