Stress-controlled fatigue behaviour of micro-sized polycrystalline copper wires

Materials Science and Engineering: A

Volumn 515, Issue 1-2, 2009, Pages 71-78

  Yang, B ^a   Motz, C ^b   Grosinger, W ^b   Dehm, G ^b,c  

^a MATERIALS CENTER LEOBEN FORSCHUNG GMBH   (Austria)

^b Erich Schmid Institute of Materials Science   (Austria)

^c UNIVERSITY OF LEOBEN   (Austria)

Author keywords

Copper; Cyclic loading; Damage; In situ; Size effect

Indexed keywords

CYCLIC LOADS; FATIGUE DAMAGE; SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; WIRE;

APPLIED STRESS; COPPER WIRES; CYCLIC LOADING; DAMAGE; IN SITU; MICROSTRUCTURAL CHANGES; POLYCRYSTALLINE COPPER; SCANNING ELECTRONS; SIZES EFFECT; STRESS AMPLITUDES;

COPPER;

EID: 65449164921     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.02.037     Document Type: Article

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