-
1
-
-
77955851392
-
Through silicon via technologies for rf mems
-
J. Zhu, Y. Yu, F. Hou, and C. Chen,"Through Silicon Via Technologies for RF MEMS", Microsystems Technology, pp. 1045-1049, 2010.
-
(2010)
, Microsystems Technology
, pp. 1045-1049
-
-
Zhu, J.1
Yu, Y.2
Hou, F.3
Chen, C.4
-
2
-
-
84866625356
-
-
International Technology Roadmap for Semiconductors 2008 Ed
-
International Technology Roadmap for Semiconductors 2008 Ed. , http://itrs. net.
-
-
-
-
3
-
-
77955191177
-
Development of novel carbon nanotube tsv technology
-
A. Gupta, B. Kim, S. Kannan, B. Ahn, and F. Mohhamad,"Development of Novel Carbon Nanotube TSV Technology", Proceeding of Electronic Components and Technologies Conference, 2010.
-
(2010)
Proceeding of Electronic Components and Technologies Conference
-
-
Gupta, A.1
Kim, B.2
Kannan, S.3
Ahn, B.4
Mohhamad, F.5
-
4
-
-
19944432253
-
Comprehensive study of the resistivity of copper wires with lateral dimensions 100 nm and smaller
-
W. Steinhogl, G. Schindler, G. Steinlesberger, M. Traving, and M. Engelhardt,"Comprehensive Study of the Resistivity of Copper Wires with Lateral Dimensions 100 nm and Smaller", Journal of Applied Physics, Vol. 97, No. 2, 023706-1-023706-7, 2005.
-
(2005)
Journal of Applied Physics
, vol.97
, pp. 20237061-0237067
-
-
Steinhogl, W.1
Schindler, G.2
Steinlesberger, G.3
Traving, M.4
Engelhardt, M.5
-
6
-
-
77955206255
-
Analysis of carbon nanotube based through silicon via
-
S. Kannan, A. Gupta, B. Kim, F. Mohammed, and B. Ahn,"Analysis of Carbon Nanotube based Through Silicon Via," Proceedings of the 60th Electronic Components and Technologies Conference, pp. 51 -57, 2010.
-
(2010)
Proceedings of the 60th Electronic Components and Technologies Conference
, pp. 51-57
-
-
Kannan, S.1
Gupta, A.2
Kim, B.3
Mohammed, F.4
Ahn, B.5
-
7
-
-
78649944493
-
Development of carbon nanotube based through-silicon vias
-
B. Kim, S. Kannan, A. Gupta, F. Mohammed, and B. Ahn,"Development of Carbon Nanotube based Through-Silicon Vias," Journal of Nanotechnology in Engineering and Medicine, Vol. 1, Issue 2, 2010.
-
(2010)
Journal of Nanotechnology in Engineering and Medicine
, vol.1
, Issue.2
-
-
Kim, B.1
Kannan, S.2
Gupta, A.3
Mohammed, F.4
Ahn, B.5
-
8
-
-
78651326478
-
Electromagnetic modeling of through-silicon via (tsv) interconnections using cylindrical modal basis functions
-
K. J. Han, M. Swaminathan, and T. Bandyopadhyay,"Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions," IEEE Transactions on Advanced Packaging, 2010.
-
(2010)
IEEE Transactions on Advanced Packaging
-
-
Han, K.J.1
Swaminathan, M.2
Bandyopadhyay, T.3
-
10
-
-
3142782244
-
Electrical resistance: An atomistic view
-
S. Datta,"Electrical Resistance: An Atomistic View, "Nanotechnology, Vol. 15, pp. S433-S451, 2004.
-
(2004)
Nanotechnology
, vol.15
-
-
Datta, S.1
-
11
-
-
2442463318
-
Adiabatic charge pumping in open quantum systems
-
J. E Avron, A. Elgart, G. M. Graf, L. Sadun, and K. Schnee, "Adiabatic charge pumping in open quantum systems," Communications on Pure and Applied Math, Vol. 57, pp. 528-561, 2004.
-
(2004)
Communications on Pure and Applied Math
, vol.57
, pp. 528-561
-
-
Avron, J.E.1
Elgart, A.2
Graf, G.M.3
Sadun, L.4
Schnee, K.5
-
12
-
-
2342466950
-
Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotube
-
P. J Burke,"Luttinger Liquid Theory as a Model of the Gigahertz Electrical Properties of Carbon Nanotube", IEEE Transactions On Nanotechnology, Vol. 1, No. 3, pp. 129-144, 2002.
-
(2002)
, IEEE Transactions on Nanotechnology
, vol.1
, Issue.3
, pp. 129-144
-
-
Burke, P.J.1
-
13
-
-
23144447428
-
Microwave transport in metallic single-walled carbon nanotubes
-
Z. Yu and P. J Burke,"Microwave Transport in Metallic Single-Walled Carbon Nanotubes," NanoLetters, Vol 5, No. 7, pp 1403, 2005.
-
(2005)
NanoLetters
, vol.5
, Issue.7
, pp. 1403
-
-
Yu, Z.1
Burke, P.J.2
-
14
-
-
0016070156
-
Design of planar rectangular microelectronic inductors
-
H. Greenhouse,"Design of planar rectangular microelectronic inductors," IEEE Transsactions on Parts, Hybrids, Packaging, vol. PHP-10, no. 2, pp. 101-109, 1974.
-
(1974)
IEEE Transsactions on Parts, Hybrids, Packaging
, vol.PHP-10
, Issue.2
, pp. 101-109
-
-
Greenhouse, H.1
-
15
-
-
0034297587
-
A substrate-dependent cad model for ceramic multilayer capacitors
-
B. Lakshminarayanan, H. C. Gordon, Jr. and T. M. Weller,"A Substrate-Dependent CAD Model for Ceramic Multilayer Capacitors," IEEE Transactions on Microwave Theory and Techniques, Vol. 48, no. 10, 2000.
-
(2000)
IEEE Transactions on Microwave Theory and Techniques
, vol.48
, Issue.10
-
-
Lakshminarayanan, B.1
Gordon Jr., H.C.2
Weller, T.M.3
-
16
-
-
0018007074
-
High-frequency measurements of Q-factors of ceramic chip capacitors
-
J. P. Maher, R. T. Jacobsen, R. E. Laferty,"High-frequency measurements of Q-factors of ceramic chip capacitors," IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 1, pp. 257-264, 1978.
-
(1978)
IEEE Transactions on Components, Hybrids and Manufacturing Technology
, vol.1
, pp. 257-264
-
-
Maher, J.P.1
Jacobsen, R.T.2
Laferty, R.E.3
-
17
-
-
0019578938
-
Design considerations for monolithic microwave circuits
-
R. A. Pucel,"Design considerations for monolithic microwave circuits," IEEE Transactions on Microwave Theory Technology, Vol. 29, pp. 513-534, 1981.
-
(1981)
IEEE Transactions on Microwave Theory Technology
, vol.29
, pp. 513-534
-
-
Pucel, R.A.1
-
18
-
-
79959698209
-
Automated characterization of ceramic multi-layer capacitors
-
E. Benabe,"Automated characterization of ceramic multi-layer capacitors," in 52nd Advanced RF Techniques Group Conference, pp. 88-94, 1998.
-
(1998)
52nd Advanced RF Techniques Group Conference
, pp. 88-94
-
-
Benabe, E.1
|