Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn , Issue , 2012, Pages 545-551

  Tiwari, Manish K ^a   Zimmermann, Severin ^a   Sharma, Chander S ^a   Alfieri, Fabio ^a   Renfer, Adrian ^a   Brunschwiler, Thomas ^b   Meijer, Ingmar ^b   Michel, Bruno ^b   Poulikakos, Dimos ^a  

^a ETH ZURICH   (Switzerland)

^b IBM RESEARCH ZURICH   (Switzerland)

Author keywords

3D chip stacks; Exergy; Hot water cooled data center; Integrated cooling; Liquid cooled electronics; Micropins; Through silicon vias (TSVs)

Indexed keywords

3D CHIP STACKS; DATA CENTERS; INTEGRATED COOLING; MICROPINS; THROUGH SILICON VIAS;

COOLANTS; ELECTRONICS ENGINEERING; EXERGY; HEAT SINKS; INTEGRATION; LIQUIDS; SUPERCOMPUTERS; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL; WATER;

ELECTRONIC COOLING;

EID: 84866174977     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2012.6231478     Document Type: Conference Paper

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