Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn , Issue , 2012, Pages 1234-1241

  Goicochea, Javier V ^a   Brunschwiler, Thomas ^a   Zurcher, Jonas ^a   Wolf, Heiko ^a   Matsumoto, Keiji ^b   Michel, Bruno ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM RESEARCH TOKYO   (Japan)

Author keywords

3D chip stacks; capillary bridging; directed self assembly; necking; particles; percolation; thermal conductivity; underfill

Indexed keywords

3D CHIP STACKS; CAPILLARY BRIDGING; DIRECTED SELF-ASSEMBLY; NECKING; UNDERFILLS;

CENTRIFUGATION; ELECTRONICS ENGINEERING; ELEMENTARY PARTICLES; NANOPARTICLES; PERCOLATION (SOLID STATE); SELF ASSEMBLY; SILICA; SILVER; SOLVENTS; SUSPENSIONS (FLUIDS); THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84866158221     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2012.6231563     Document Type: Conference Paper

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