Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint

Electronic Materials Letters

Volumn 8, Issue 4, 2012, Pages 463-466

  He, Hongwen ^a   Cao, Liqiang ^a   Wan, Lixi ^a   Zhao, Haiyan ^b   Xu, Guangchen ^c   Guo, Fu ^c  

^a INSTITUTE OF MICROELECTRONICS   (China)

^b TSINGHUA UNIVERSITY   (China)

^c BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

electromigration; Joule heating effect; oxide whisker; VS mechanism

Indexed keywords

CURRENT-STRESSING; DRIVING FORCES; HEATING EFFECT; HIGH CURRENT DENSITIES; JOULE HEATING EFFECT; METAL OXIDES; SOLDER JOINTS; VAPOR SOLID MECHANISM; WHISKER GROWTH;

ELECTROMIGRATION; METALLIC COMPOUNDS; THERMAL EVAPORATION; TIN; VAPORS;

JOULE HEATING;

EID: 84865813144     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-2019-9     Document Type: Article

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