-
1
-
-
77951186118
-
Cooling energy-hungry data centers
-
G.I. Meijer, Cooling energy-hungry data centers, Science 328 (2010) 318-319.
-
(2010)
Science
, vol.328
, pp. 318-319
-
-
Meijer, G.I.1
-
2
-
-
79952129852
-
3D integrated water cooling of a composite multilayer stack of chips
-
F. Alfieri, M.K. Tiwari, I. Zinovik, D. Poulikakos, T. Brunschwiler, B. Michel, 3D integrated water cooling of a composite multilayer stack of chips, J. Heat Transf.-Trans. ASME 132 (12) (2010) 121402.
-
(2010)
J. Heat Transf.-Trans. ASME
, vol.132
, Issue.12
, pp. 121402
-
-
Alfieri, F.1
Tiwari, M.K.2
Zinovik, I.3
Poulikakos, D.4
Brunschwiler, T.5
Michel, B.6
-
3
-
-
70449637149
-
Thermal management of vertically integrated packages
-
P. Garrou, C. Bower, P. Ramm (Eds.) Wiley-VCH Verlag GmbH & Co, KGaA, Weinheim
-
T. Brunschwiler, B. Michel, Thermal management of vertically integrated packages, in: P. Garrou, C. Bower, P. Ramm (Eds.), Handbook of 3D Integration, Wiley-VCH Verlag GmbH & Co, KGaA, Weinheim, 2008.
-
(2008)
Handbook of 3D Integration
-
-
Brunschwiler, T.1
Michel, B.2
-
4
-
-
80052670965
-
Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
-
A. Renfer, M.K. Tiwari, T. Brunschwiler, B. Michel, D. Poulikakos, Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics, Experiments in Fluids 51 (3) (2011) 731-741.
-
(2011)
Experiments in Fluids
, vol.51
, Issue.3
, pp. 731-741
-
-
Renfer, A.1
Tiwari, M.K.2
Brunschwiler, T.3
Michel, B.4
Poulikakos, D.5
-
5
-
-
34249887919
-
A practical implementation of silicon microchannel coolers for high power chips
-
DOI 10.1109/TCAPT.2007.897977
-
E.G. Colgan, B. Furman, M. Gaynes, W.S. Graham, N.C. LaBianca, J.H. Magerlein, R.J. Polastre, M.B. Rothwell, R.J. Bezama, R. Choudhary, K.C. Marston, H. Toy, J. Wakil, J.A. Zitz, R.R. Schmidt, A practical implementation of silicon microchannel coolers for high power chips, IEEE Trans. Compon. Packaging Technol. 30 (2) (2007) 218-225. (Pubitemid 46864849)
-
(2007)
IEEE Transactions on Components and Packaging Technologies
, vol.30
, Issue.2
, pp. 218-225
-
-
Colgan, E.G.1
Furman, B.2
Gaynes, M.3
Graham, W.S.4
LaBianca, N.C.5
Magerlein, J.H.6
Polastre, R.J.7
Rothwell, M.B.8
Bezama, R.J.9
Choudhary, R.10
Marston, K.C.11
Toy, H.12
Wakil, J.13
Zitz, J.A.14
Schmidt, R.R.15
-
7
-
-
17644411021
-
Investigation of heat transfer in rectangular microchannels
-
DOI 10.1016/j.ijheatmasstransfer.2004.11.019, PII S0017931005000074
-
P.S. Lee, S.V. Garimella, D. Liu, Investigation of heat transfer in rectangular microchannels, International Journal of Heat and Mass Transfer 48 (9) (2005) 1688-1704. (Pubitemid 40572468)
-
(2005)
International Journal of Heat and Mass Transfer
, vol.48
, Issue.9
, pp. 1688-1704
-
-
Lee, P.-S.1
Garimella, S.V.2
Liu, D.3
-
8
-
-
33845578021
-
Direct liquid jet-impingement cooling with micronsized nozzle array and distributed return architecture
-
DOI 10.1109/ITHERM.2006.1645343, 1645343, Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
-
T. Brunschwiler, H. Rothuizen, M. Fabbri, U. Kloter, B. Michel, R.J. Bezama, G. Natarajan, Direct liquid jet-impingement cooling with micron-sized nozzle array and distributed return architecture, in: IEEE Proceedings 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, 2006, pp. 196-203. (Pubitemid 44929482)
-
(2006)
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
, vol.2006
, pp. 196-203
-
-
Brunschwiler, T.1
Rothuizen, H.2
Fabbri, M.3
Kloter, U.4
Michel, B.5
Bezama, R.J.6
Natarajan, G.7
-
9
-
-
77955293977
-
Experimental investigation of an ultra-thin manifold microchannel heat sink for liquidcooled chips
-
W. Escher, T. Brunschwiler, B. Michel, D. Poulikakos, Experimental investigation of an ultra-thin manifold microchannel heat sink for liquidcooled chips, J. Heat Transfer 132 (8) (2010) 081402.
-
(2010)
J. Heat Transfer
, vol.132
, Issue.8
, pp. 081402
-
-
Escher, W.1
Brunschwiler, T.2
Michel, B.3
Poulikakos, D.4
-
10
-
-
77953618263
-
A novel high performance, ultra thin heat sink for electronics
-
W. Escher, B. Michel, D. Poulikakos, A novel high performance, ultra thin heat sink for electronics, International Journal of Heat and Fluid Flow 31 (4) (2010) 586-598.
-
(2010)
International Journal of Heat and Fluid Flow
, vol.31
, Issue.4
, pp. 586-598
-
-
Escher, W.1
Michel, B.2
Poulikakos, D.3
-
11
-
-
54749110679
-
Worldwide electricity used in data centers
-
J.G. Koomey, Worldwide electricity used in data centers, Environ. Res. Lett. 3 (3) (2008).
-
(2008)
Environ. Res. Lett.
, vol.3
, Issue.3
-
-
Koomey, J.G.1
-
12
-
-
81555197280
-
Direct waste heat utilization from liquid-cooled supercomputers
-
Washington
-
T. Brunschwiler, G.I. Meijer, S. Paredes, W. Escher, B. Michel, Direct waste heat utilization from liquid-cooled supercomputers, in: Proceedings of the 14th International Heat Transfer Conference, Washington, 2010, pp. 23352.
-
(2010)
Proceedings of the 14th International Heat Transfer Conference
, pp. 23352
-
-
Brunschwiler, T.1
Meijer, G.I.2
Paredes, S.3
Escher, W.4
Michel, B.5
-
13
-
-
70350739203
-
Toward zero-emission data centers through direct reuse of thermal energy
-
Paper 11
-
T. Brunschwiler, B. Smith, E. Ruetsche, B. Michel, Toward zero-emission data centers through direct reuse of thermal energy, IBM J. Res. & Dev. 53 (3) (2009). Paper 11.
-
(2009)
IBM J. Res. & Dev.
, vol.53
, Issue.3
-
-
Brunschwiler, T.1
Smith, B.2
Ruetsche, E.3
Michel, B.4
-
14
-
-
79959372691
-
Optimal waste heat recovery and reuse in industrial zones
-
M.Z. Stijepovic, P. Linke, Optimal waste heat recovery and reuse in industrial zones, Energy 36 (7) (2011) 4019-4031.
-
(2011)
Energy
, vol.36
, Issue.7
, pp. 4019-4031
-
-
Stijepovic, M.Z.1
Linke, P.2
-
15
-
-
33846677757
-
An exergy-based figure-of-merit for electronic packages
-
DOI 10.1115/1.2351901
-
A.J. Shah, V.P. Carey, C.E. Bash, C.D. Patel, An exergy-based figure-of-merit for electronic packages, J. Electron. Packag. 128 (4) (2006) 360-369. (Pubitemid 46191442)
-
(2006)
Journal of Electronic Packaging, Transactions of the ASME
, vol.128
, Issue.4
, pp. 360-369
-
-
Shah, A.J.1
Carey, V.P.2
Bash, C.E.3
Patel, C.D.4
-
16
-
-
36549041793
-
Role of exergy in increasing efficiency and sustainability and reducing environmental impact
-
DOI 10.1016/j.enpol.2007.09.006, PII S0301421507003886
-
M.A. Rosen, I. Dincer, M. Kanoglu, Role of exergy in increasing efficiency and sustainability and reducing environmental impact, Energy Policy 36 (1) (2008) 128-137. (Pubitemid 350177460)
-
(2008)
Energy Policy
, vol.36
, Issue.1
, pp. 128-137
-
-
Rosen, M.A.1
Dincer, I.2
Kanoglu, M.3
-
17
-
-
41649090202
-
Exergy analysis of data center thermal management systems
-
A.J. Shah, V.P. Carey, C.E. Bash, C.D. Patel, Exergy analysis of data center thermal management systems, J. Heat Transf.-Trans. ASME 130 (2) (2008) 021401.
-
(2008)
J. Heat Transf.-Trans. ASME
, vol.130
, Issue.2
, pp. 021401
-
-
Shah, A.J.1
Carey, V.P.2
Bash, C.E.3
Patel, C.D.4
-
18
-
-
85030488731
-
-
Data Center Knowledge, IBM's hot-water supercomputer goes live, 2010, http://www.datacenterknowledge.com/archives/2010/07/05/ibms-hot- watersupercomputer- goes-live/.
-
(2010)
IBM's Hot-water Supercomputer Goes Live
-
-
-
19
-
-
79952019405
-
Hot water cooled heat sinks for efficient data center cooling: Towards electronic cooling with high exergetic utility
-
P. Kasten, S. Zimmermann, M.K. Tiwari, B. Michel, D. Poulikakos, Hot water cooled heat sinks for efficient data center cooling: Towards electronic cooling with high exergetic utility, Frontiers in Heat and Mass Transfer 1 (2) (2010) 023006.
-
(2010)
Frontiers in Heat and Mass Transfer
, vol.1
, Issue.2
, pp. 023006
-
-
Kasten, P.1
Zimmermann, S.2
Tiwari, M.K.3
Michel, B.4
Poulikakos, D.5
-
20
-
-
0026107362
-
Pcb trace thermal analysis and effective conductivity 1991 proceedings seventh annual ieee semiconductor thermal measurement and management symposium (cat. no. 91ch2972-8)|1991
-
10.1109/STHERM.1991.152906
-
T.F. Lemczyk, B. Mack, J.R. Culham, M.M. Yovanovich, PCB trace thermal analysis and effective conductivity, 1991 Proceedings, Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No. 91CH2972-8)|1991 Proceedings, Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.91CH2972-8), (1991) 10.1109/STHERM.1991.152906.
-
(1991)
Proceedings Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.91CH2972-8)
-
-
Lemczyk, T.F.1
MacK, B.2
Culham, J.R.3
Yovanovich, M.M.4
-
21
-
-
84861776270
-
Aquasar: A hot water cooled data center with direct energy reuse
-
S. Zimmermann, M.K. Tiwari, G.I. Meijer, B. Michel, D. Poulikakos, Aquasar: A hot water cooled data center with direct energy reuse, Energy 43 (1) (2012) 237-245.
-
(2012)
Energy
, vol.43
, Issue.1
, pp. 237-245
-
-
Zimmermann, S.1
Tiwari, M.K.2
Meijer, G.I.3
Michel, B.4
Poulikakos, D.5
-
24
-
-
0031011385
-
A review of organic rankine cycles (ORCs) for the recovery of low-grade waste heat
-
DOI 10.1016/S0360-5442(96)00165-X, PII S036054429600165X
-
T.C. Hung, T.Y. Shai, S.K. Wang, A review of organic rankine cycles (ORCs) for the recovery of low-grade waste heat, Energy 22 (7) (1997) 661-667. (Pubitemid 27206837)
-
(1997)
Energy
, vol.22
, Issue.7
, pp. 661-667
-
-
Hung, T.C.1
Shai, T.Y.2
Wang, S.K.3
|