Ceramic modules for micro solid-oxide fuel cells

Proceedings - 2011 IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011

Volumn , Issue , 2011, Pages 9-16

  Maeder, Thomas ^a   Jiang, Bo ^a   Yan, Yan ^a   Ryser, Peter ^a   Muralt, Paul ^a  

^a EPFL   (Switzerland)

Author keywords

3D structuration; LTCC; Mineral sacrificial layers; Processing; Sensors; Thick film

Indexed keywords

ELECTRICAL INTERCONNECTIONS; LOW TEMPERATURE CO FIRED CERAMIC(LTCC); LTCC; MICROFABRICATION PROCESS; SACRIFICIAL LAYER; STRUCTURATION; THERMAL CHARACTERISATION; THERMAL CONDUCTION LOSS;

BOROSILICATE GLASS; CERAMIC PRODUCTS; COMBUSTORS; ELECTRIC CONNECTORS; INTEGRATION; INTERCONNECTION NETWORKS; MICROSYSTEMS; PROCESSING; SENSORS; SILICON; SOLID OXIDE FUEL CELLS (SOFC); STRESSES; THERMAL EXPANSION; THICK FILMS;

INTEGRATION TESTING;

EID: 84864829392     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (39)

1. A. Evans, A. Bieberle-Hütter, H. Galinski, J.L.M. Rupp, T. Ryll, B. Scherrer, R. Tölke, L.J. Gauckler, "Micro-solid oxide fuel cells: status, challenges, and chances", Monatshefte für Chemie 140, 975-983, 2009.
2. A. Bieberle-Hütter, D. Beckel, A. Infortuna, U.P., Muecke, J.L.M. Rupp, L.J., Gauckler, S., Rey-Mermet, P. Muralt, N.R. Bieri, N. Hotz, "A micro-solid oxide fuel cell system as battery replacement", Journal of Power Sources 177, 123-130, 2008.
3. Evans A, Bieberle-Hütter A, Rupp JLM, Gauckler LJ, "Review on microfabricated micro-solid oxide fuel cell membranes", Journal of Power Sources 194, 119-129, 2009.
4. U.P. Muecke, D. Beckel, A. Bernard, A. Bieberle-Hütter, S. Graf, A. Infortuna, P. Müller, J.L.M. Rupp, J. Schneider, L.J. Gauckler, "Micro solid oxide fuel cells on glass ceramic substrates", Advanced Functional Materials 18 (20), 3158-3168, 2008.
5. D. Beckel, A. Bieberle-Hütter, A. Harvey, A. Infortuna, U.P. Muecke, M. Prestat, J.L.M. Rupp, L.J. Gauckler, "Thin films for micro solid oxide fuel cells", Journal of Power Sources 173, 325-345, 2007.
6. A. Bieberle-Hütter, L.J. Bonderer, A. Evans, M. Prestat, J.M.L. Rupp, T. Ryll, B. Scherrer, R. Tölke, L.J. Gauckler, Y. Yan, P. Muralt, B. Jiang, T. Maeder, M. Nabavi, A. Santis, D. Poulikakos, P. Niedermann, A. Dommann, C. Meier, T. Hocker, P. Heeb, A. Bernard, "Micro-solid oxide fuel cells as power supply for small portable electronic equipment", Proceedings, PowerMEMS 2010, 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, Leuven (BE), 69-72, 2010.
7. S.B. Schaevitz, A. Franz, R. Barton, A.P. Ludwiszewski, "Micro-solid oxide fuel cells as power supply for small portable electronic equipment", USA patent application, 2006.
8. A. Ludwiszewski, "Silicon based solid oxide fuel cell chip for portable consumer electronics - Final technical report", USA Department of Energy (DoE) report DOE/GO/88102-3, 2009.
9. S. Rey-Mermet, P. Muralt, "Solid oxide fuel cell membranes supported by nickel grid anode", Solid State Ionics 179, 1497-1500, 2008.
10. B. Jiang, T. Maeder, P. Muralt, "A new platform concept for micro-scale SOFC using low temperature co-fired ceramic technology", Proceedings, PowerMEMS 2010, 10th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, Leuven (BE), 207-210, 2010.
11. U. Chowdhry, A.W. Sleight, "Ceramic substrates for microelectronic packaging", Annual Reviews of Materials Science 17, 323- 340, 1987.
12. R.R. Tummala, "Ceramics in microelectronic packaging", American Ceramic Society Bulletin 67 (4), 752-758, 1988.
13. A. Roosen, "Entwicklungspotentiale keramischer Substratwerkstoffe [Development potential of ceramic substrate materials]", IMAPS Deutschland Konferenz, 1999.
14. F.D. Barlow, A. Elshabini, (ed.), "Ceramic interconnect technology handbook", CRC Press (USA), 2007.
15. K. Pitt (ed.), "Handbook of thick film technology, 2nd ed.", Electrochemical Publications, 2005.
16. R. Bauer, L. Rebenklau, M. Luniak, K.J. Wolter, "Mikrotechnische Applikationen mit der Dickfilmtechnik [Microtechnological applications with thick-film technology]", ISHM Deutschland Konferenz, München, DE, 1998.
17. M. Massiot, B. Roesner, "New 3D possibilities of LTCC technology", Proceedings, 14th European Microelectronics and Packaging Conference - IMAPS, Friedrichshafen (DE), 25-28, 2003.
18. K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.D. Wroblewski, M. Okandan, "Novel microsystem applications with new techniques in low-temperature co-fired ceramics", International Journal of Applied Ceramic Technology 2 (5), 345-363, 2005.
19. T. Maeder, Y. Fournier, S. Wiedmer, H. Birol, C. Jacq, P. Ryser, "3D structuration of LTCC/thick-film sensors and fluidic devices", Proceedings, 3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, USA, THA13, 2007.
20. Y. Fournier, "3D structuration techniques of LTCC for microsystems applications", PhD Thesis Nr 4772, EPFL, Switzerland, 2010.
21. L.E. Khoong, Y.M. Tan, Y.C. Lam, "Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate", Journal of the European Ceramic Society 30 (10), 1973-1987, 2010.
22. M. Hrovat, D. Belavi, G. Dolanc, P. Fajdiga, S. Hoevar, M.S. Zarnik, J. Holc, M. Kosec, "A ceramics-based microreactor: 3D LTCC structures and a preliminary evaluation", Proceedings, XXXIII International Conference of IMAPS Poland Chapter, Gliwice - Pszczyna, Poland, 155-158, 2009.
23. T. Maeder, Y. Fournier, C. Jacq, D. Sonney, H. Birol, R. Willigens, P. Ryser, "Sensors and packages based on LTCC and thick-film technology for severe conditions", Presentation, Swiss-Singapore Workshop on Sensors for Harsh Environments, Singapore, 2007.
24. T. Maeder, N. Dumontier, T. Haller, Y. Fournier, F. Seigneur, P. Ryser, "LTCC active oxygen getter module for hermetic packaging applications", Proceedings, International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Munich (DE), 309- 314 (WP25), 2008.
25. Seigneur F., Fournier Y., Maeder T., Ryser P., Jacot J., "Hermetic package for optical MEMS", Journal of Microelectronics and Electronic Packaging 6 (1), 32-37, 2009.
26. A. Barras, "Integrated infrared source in LTCC technology", Masters Project, Microengineering, EPFL, Switzerland, 2010.
27. S.N. Reddy, J. Wang, W.K. Jones, "Development of a low-power 700°C micro heater in low temperature cofire ceramics", Proceedings of the 15th European Microelectronics and Packaging Conference (EMPC), Brugge (BE), IMAPS, S2.04, 85-89, 2005.
28. J. Kita, F. Rettig, R. Moos, K.H. Drüe, H. Thust, "Hot-plate gas sensors - are ceramics better?", Proceedings, 1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Baltimore, USA, WP13, 2005.
29. R. Moos, J. Kita, "Ceramic multilayer gas sensors - an overview", Proceedings, XXXI International Conference of IMAPS Poland Chapter, Krasiczyn, Poland, 75-82, 2007.
30. C. Bienert, A. Roosen, "Limiting factors for the application of LTCC at elevated temperatures", Proceedings, International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Munich (DE), 133-138 (TP34), 2008.
31. C. Bienert, A. Roosen, "Characterization of material behavior of low temperature cofired ceramics at elevated temperatures", Proceedings, 5rd IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Denver, USA, TP23, 2009.
32. A. Gutierrez, A.J. Moll, D.G. Plumlee, "High temperature deflection of LTCC", Proceedings, International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Munich (DE), 127-132 (TP33), 2008.
33. M. Unger, W. Smetana, T. Koch, G. Radosavljevic, "High temperature characteristics of various LTCC-tapes", Proceedings, XXXIII International Conference of IMAPS Poland Chapter, Gliwice - Pszczyna, Poland, 355-358, 2009.
34. K. Malecha, T. Maeder, C. Jacq, P. Ryser, "Comparison of solvent and sacrificial volume-material-based lamination processes of low-temperature co-fired ceramics tapes", Microelectronics Reliability, in press, 2011, doi:10.1016/j.microrel.2010.11.009.
35. D. Jurków, L. Golonka, "Novel cold chemical lamination bonding technique - a simple LTCC thermistor-based flow sensor", Journal of the European Ceramic Society 29 (10), 1971-1976, 2009.
36. M.A. Schneider, T. Maeder, P. Ryser, F. Stoessel, "A microreactor-based system for the study of fast exothermic reactions in liquid phase: characterization of the system", Chemical Engineering Journal 101, 241-250, 2004.
37. A. Dziedzic, L. Golonka, B.M. Licznerski, G. Hielscher, "Heaters for gas sensors from thick conductive or resistive films", Sensors and Actuators B 18-19, 535-539, 1994.
38. Y. Yan, J. Conde, P. Muralt, "Electrolyte and Cathode Studies for Micro-Solid Oxide Fuel Cell", MRS Proceedings Spring meeting 2010, Vol 1256, 1256-50 (2010).
39. S. Rey-Mermet, Y. Yan, C. Sandu, G. Deng, P. Muralt, "Nanoporous YSZ film in electrolyte membrane of micro solid oxide fuel cell", Thin Solid Films, 4743-46 (2010).