Novel cold chemical lamination bonding technique-A simple LTCC thermistor-based flow sensor

Journal of the European Ceramic Society

Volumn 29, Issue 10, 2009, Pages 1971-1976

  Jurkow D ^a   Golonka, L ^a  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Joining; LTCC; Pressing; Sensors; Thermistors

Indexed keywords

BONDING METHODS; BONDING TECHNIQUES; CHAMBER GEOMETRIES; FLOW SENSORS; GREEN TAPES; HIGH PRESSURES; LOW PRESSURES; LTCC; MEASUREMENT RANGES; MICRO-FLUIDIC DEVICES; OUTPUT SIGNALS; PRESSING; ROOM TEMPERATURES; SENSOR PARAMETERS; SOLVENT-BASED METHODS; TEST DEVICES; THERMO COMPRESSIONS; WORKING PRESSURES; WORKING TEMPERATURES;

JOINING; LAMINATING; PUMPS; THERMISTORS;

SENSORS;

EID: 67349146356     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2008.12.008     Document Type: Article

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