Hermetic package for optical MEMS

Journal of Microelectronics and Electronic Packaging

Volumn 6, Issue 1, 2009, Pages 32-37

  Seigneur, F ^a   Fournier, Y ^a   Maeder, T ^a   Ryser, P ^a   Jacot, J ^a  

^a EPFL   (Switzerland)

Author keywords

Hermetic packaging; Interconnections; LTCC; MOEMS; Solder sealing

Indexed keywords

ANTIREFLECTION COATINGS; CHIP SCALE PACKAGES; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; GLASS; GOLD; LAMINATING; SCREEN PRINTING; SEALING (CLOSING); SILICONES; SOLDERING; SPACE APPLICATIONS; TEMPERATURE; THIN FILMS;

ELECTRICAL CONNECTION; HERMETIC PACKAGING; INTERCONNECTIONS; LTCC; MECHANICAL POSITIONING; THERMALLY INDUCED STRESS; THICK AND THIN FILMS; THIN FILM METALLIZATION;

MOEMS;

EID: 84876987568     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-6.1.32     Document Type: Article

References (12)

1. W. Noell, M. Zickar, and N. de Rooij, "Two-axis MEMS mirror for precise beam steering without feedback," in Proceedings of the 6th ESA Round Table on Micro/Nano Technologies for Space, 2007.
2. DuPont Green Tape 951 System, DuPont MCM, Microcircuit Materials, http://www2.dupont.com/MCM/en-US/.
3. MegArray Connector 84740-102LF, FCI, http://www.fciconnect.com.
4. HYDE, Durst CAD/Consulting GmbH, Holzgerlingen, Germany.
5. Y. Fournier, L. Bieri, T. Maeder, and P. Ryser, "Influence of lamination parameters on LTCC shrinkage under unconstrained sintering," in Proceedings of the 4th European Microelectronics and Packaging Symposium, IMAPS, pp. 165-170, 2006.
6. TopKlean, Avantec Performance Chemicals, 94683 Vincennes CEDEX, France.
7. J. Kalenik, R. Kisiel, A. Mlozniak, and Z. Szczepanski, "Some properties of SnAg and SnAgCu solder joints on printed circuit boards," in Proceedings of the XXVIII International Conference of IMAPS, pp. 277-280, 2004.
8. J. Villain, T. Qasim, J. Pahl, and H. Masuch, "Struktur und Eigenschaften von Vapor-Phase umgeschnolzenen SnBi- und SnZn- Lötverbindungen an SMD-Bauelementen," IMAPS Deutschland Konferenz, Miinchen.
9. F. Hua and J. Glazer, "Lead-free solders for electronic assembly," in Proceedings of Design and Reliability of Solder Interconnects, TMS Symposium, pp. 65-73, 1997.
10. Wei, Y., C. L. Chow, K.J. Lau, P. Vianco, H.E. Fang, "Behavior of lead-free solder under thermomechanical loading," Journal of Electronic Packaging, Vol. 126, pp. 367-373.
11. F. Seigneur, T. Maeder, and J. Jacot, "Laser soldered packaging hermeticity measurement using metallic conductor resistance," in Proceedings of the XXX International Conference of IMAPS, 2006.
12. T. Maeder, Y. Fournier, F. Seigneur, and P. Ryser, "LTCC active oxygen getter module for hermetic packaging applications," in Proceedings of the IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, 2008.