Ultra compact and high reliable SiC MOSFET power module with 200°C operating capability

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2012, Pages 81-84

  Horio, Masafumi ^a   Iizuka, Yuji ^a   Ikeda, Yoshinari ^a   Mochizuki, Eiji ^a   Takahashi, Yoshikazu ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

epoxy resin moulding; SiC power module; Silver sintering

Indexed keywords

COPPER BLOCKS; CURRENT PATHS; HIGH RELIABILITY; HIGH RELIABLE; HIGH TEMPERATURE; HIGH-DENSITY PACKAGING; INTERNAL INDUCTANCE; OPERATING CAPABILITY; POWER CIRCUIT; POWER MODULE; SIC DEVICES; SIC MOSFET; SILICON CARBIDE MOSFETS; SILICON NITRIDE CERAMICS;

COPPER; ELECTRIC POWER SYSTEMS; EPOXY RESINS; MOLDING; MOSFET DEVICES; RESINS; SILICON NITRIDE; SINTERING;

SILICON CARBIDE;

EID: 84864742647     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2012.6229028     Document Type: Conference Paper

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