Investigation on wirebond-less power module structure with high-density packaging and high reliability

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2011, Pages 272-275

  Ikeda, Yoshinari ^a   Iizuka, Yuji ^a   Hinata, Yuichiro ^a   Horio, Masafumi ^a   Hori, Motohito ^a   Takahashi, Yoshikazu ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONNECTING LINES; HIGH POWER APPLICATIONS; HIGH RELIABILITY; HIGH THERMAL CONDUCTIVITY; HIGH-DENSITY PACKAGING; INSULATED SUBSTRATES; INTERCONNECTION STRUCTURE; PACKAGE STRUCTURE;

ELECTRIC POWER SYSTEMS;

CHIP SCALE PACKAGES;

EID: 84860196740     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2011.5890843     Document Type: Conference Paper

References (5)

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2. Y.Ikeda, Y.Iizuka, T.Asai, T.Goto, Y.Takahashi, "A study on the reliability of the chip surface solder joint", Proc. of ISPSD., pp.189-192, 2008.
3. Kariya, Journal of electrical Material, Vol.27, No.7, p.866, 1998.
4. Y.Ikeda, H.Hokazono, S.Sakai, T.Nishimura, Y.Takahashi, "A study of the bonding-wire reliability on the chip surface electrode in IGBT", Proc. of ISPSD., pp.289-292, 2010.
5. Y.Ikeda, N.Nashida, M.Horio, H.Takubo, Y.Takahashi, "Ultra Compact, Low Thermal Impedance and High Reliability Module Structure with SiC Schottky Barrier Diodes", IEEE APEC Technical Session, 2011.