Multilayer bonding using a conformal adsorbate film (CAF) for the fabrication of 3D monolithic microfluidic devices in photopolymer

Journal of Micromechanics and Microengineering

Volumn 22, Issue 8, 2012, Pages

  Gutierrez Rivera, L ^a   Martinez Quijada, J ^a   Johnstone, R ^b   Elliott, D ^a   Backhouse, C ^c   Sameoto, D ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

^b Teledyne DALSA   (Canada)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE LAYERS; BONDING INTERFACES; BONDING MECHANISM; BONDING METHODS; BONDING PROCESS; BONDING STRENGTH; CAPILLARY FILLING; CMOS TECHNOLOGY; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; CROSS-LINKING DENSITY; CROSSLINKED; LAB-ON-A-CHIP SYSTEMS; MASS PRODUCTION; MICRO-FLUIDIC DEVICES; MICROFABRICATION PROCESS; MICROFLUIDIC STRUCTURES; MULTILAYER STRUCTURES; OPTIMUM STRUCTURES; PATTERNED LAYERS; PHOTOPOLYMER LAYERS; POLYMER CHAINS; RESIST DEFORMATION; SEMICONDUCTOR INDUSTRY; THERMOCOMPRESSIVE BONDING; ULTRA-THIN;

ADHESIVES; ADSORBATES; CMOS INTEGRATED CIRCUITS; FLUIDIC DEVICES; MULTILAYERS; PHOTOPOLYMERS; ROOM AND PILLAR MINING; SEMICONDUCTOR DEVICE MANUFACTURE; STRUCTURAL OPTIMIZATION; STRUCTURES (BUILT OBJECTS); SUBSTRATES; THREE DIMENSIONAL;

INTERFACES (MATERIALS);

EID: 84864440328     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/8/085018     Document Type: Article

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