Parametric study of efficient thermal dissipation in an LED back light unit

Microelectronics International

Volumn 28, Issue 3, 2011, Pages 12-18

  Kim, Jin Taek ^a   Lee, Cheul Ro ^a   Kim, Daesuk ^a   Baek, Byung Joon ^a  

^a Chonbuk National University   (South Korea)

Author keywords

Back light unit; Heat spreader; Junction temperature; Light emission; Light emitting diodes; Light guide panel; Metal core PCB; Printed circuit boards; Thermal dissipation

Indexed keywords

BACKLIGHT UNITS; HEAT SPREADERS; JUNCTION TEMPERATURES; LIGHT GUIDE PANEL; THERMAL DISSIPATION;

COMPUTATIONAL FLUID DYNAMICS; GALLIUM NITRIDE; HEATING EQUIPMENT; LIGHT EMISSION; PRINTED CIRCUIT BOARDS; SAPPHIRE; SILICONES; TEMPERATURE CONTROL; THERMOANALYSIS; THREE DIMENSIONAL;

LIGHT EMITTING DIODES;

EID: 84863071168     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565361111162576     Document Type: Article

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