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Volumn , Issue , 2008, Pages 795-797
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Thermal management and novel package design of high power light-emitting diodes
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Author keywords
[No Author keywords available]
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Indexed keywords
ABS RESINS;
COMPUTER NETWORKS;
COPPER;
DC GENERATORS;
ELECTROMAGNETIC WAVES;
ELECTRONIC EQUIPMENT MANUFACTURE;
LIGHT EMISSION;
LIGHT EMITTING DIODES;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
RESINS;
TEMPERATURE CONTROL;
THERMAL VARIABLES CONTROL;
ADHESIVE RESINS;
LUMINOUS INTENSITY;
THERMAL MANAGEMENT;
LUMINOUS MATERIALS;
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EID: 51349120308
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2008.4550065 Document Type: Conference Paper |
Times cited : (8)
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References (5)
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