Thermal analysis of LED package

Microelectronics International

Volumn 23, Issue 1, 2006, Pages 19-25

  Karim, N Aizar Abdul ^a,c   Narayana, P A Aswatha ^b,d,e   Seetharamu, K N ^b,f  

^a AGILENT TECHNOLOGIES   (Malaysia)

^b SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

^c University Science Malaysia ^*  (Malaysia)

^d SCHOOL OF PHYSICS   (Malaysia)

^e Indian National Academy of Engineering   (India)

^f INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

Author keywords

Light emitting diodes; Simulation; Thermal efficiency

Indexed keywords

EID: 31144476999     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360610642714     Document Type: Article

References (9)