PC board thermal management of high power LEDs

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2008, Pages 63-67

  Yu, J H ^a   Oepts, Wouter ^a   Konijn, Huub ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Board thermal resistance; Closely or densely packed LEDs; FR4 filled and capped vias; PC board reliability; PC board thermal management; Power LEDs; Solder joint reliability

Indexed keywords

COMPUTER NETWORKS; COST EFFECTIVENESS; DC GENERATORS; ELECTRIC CONDUCTIVITY; ELECTRONIC EQUIPMENT MANUFACTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; SEMICONDUCTOR MATERIALS; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; THERMAL VARIABLES MEASUREMENT; WELDING;

BOARD THERMAL RESISTANCE; CLOSELY OR DENSELY PACKED LEDS; FR4 FILLED AND CAPPED VIAS; PC BOARD RELIABILITY; PC BOARD THERMAL MANAGEMENT; POWER LEDS; SOLDER JOINT RELIABILITY;

MANAGEMENT;

EID: 51349164959     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2008.4509368     Document Type: Conference Paper

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