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Volumn 13, Issue 3, 2012, Pages 144-148

Dry etching properties of TiO 2 thin film using inductively coupled plasma for resistive random access memory application

Author keywords

AES; BCl 3; ICP; TiO 2; XPS

Indexed keywords

AES; BCL 3; CHEMICAL PATHWAYS; CHEMICAL STATE; DC BIAS VOLTAGE; ETCH RATES; ETCHED SURFACE; ETCHING CHARACTERISTICS; ETCHING MECHANISM; ETCHING PROCESS; ETCHING PROPERTIES; GAS MIXING RATIO; ICP; INDUCTIVELY-COUPLED; PROCESS PRESSURE; RESISTIVE RANDOM ACCESS MEMORY; RF-POWER; SUBSTRATE TEMPERATURE; TIO;

EID: 84862689420     PISSN: 12297607     EISSN: 20927592     Source Type: Journal    
DOI: 10.4313/TEEM.2012.13.3.144     Document Type: Article
Times cited : (11)

References (15)
  • 14
    • 28144431811 scopus 로고    scopus 로고
    • [DOI:10.1016/j.jallcom.2004.11.129]
    • A. Leon, D. Schild, M. Fichtner, J. Alloys Compd. 404-406 766 (2005) [DOI:10.1016/j.jallcom.2004.11.129].
    • (2005) J. Alloys Compd , vol.766 , pp. 404-406
    • Leon, A.1    Schild, D.2    Fichtner, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.