Dry etch chemistries for TiO2 thin films

Applied Surface Science

Volumn 185, Issue 1-2, 2001, Pages 27-33

  Norasetthekul, S ^a   Park, P Y ^a   Baik, K H ^a   Lee, K P ^a   Shin, J H ^a,b   Jeong, B S ^a   Shishodia, V ^a   Lambers, E S ^a   Norton, D P ^a   Pearton, S J ^a  

^a University of Florida   (United States)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Etch rate; Plasma chemistries; TiO2 thin film

Indexed keywords

DRY ETCHING; MORPHOLOGY; PHOTORESISTS; PLASMAS; SPUTTERING; TITANIUM DIOXIDE;

PHOTORESIST MASKING; PLASMA CHEMISTRY;

THIN FILMS;

EID: 0035965955     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(01)00562-1     Document Type: Article

References (23)