Mechanics prediction of the fracture pattern on scratching wafers of single crystal silicon

Acta Materialia

Volumn 60, Issue 11, 2012, Pages 4448-4460

  Vodenitcharova, Tania ^a   Borrero López, Oscar ^a,b   Hoffman, Mark ^a  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

^b UNIVERSITY OF EXTREMADURA   (Spain)

Author keywords

Anisotropy; Finite element analysis; Fracture; Scratch test; Silicon

Indexed keywords

CLEAVAGE PLANE; CRACK LENGTH; FRACTURE PATTERN; INITIAL DEFECTS; MECHANICAL LOADING; SCRATCH TEST; SINGLE CRYSTAL SILICON; SINGLE-CRYSTAL MATERIALS; SINGLE-CRYSTAL SILICON WAFERS; STRESS STATE; WAFER SURFACE;

ANISOTROPY; CRACKS; FINITE ELEMENT METHOD; FRACTURE; LOADING; MONOCRYSTALLINE SILICON; SILICON; SINGLE CRYSTALS;

SILICON WAFERS;

EID: 84861845053     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.04.040     Document Type: Article

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