Surface/subsurface damage and the fracture strength of ground ceramics

Journal of Materials Processing Technology

Volumn 57, Issue 3-4, 1996, Pages 207-220

  Li, Kun ^a   Liao, T Warren ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; COMPUTER SIMULATION; DEGRADATION; FRACTURE TOUGHNESS; GRINDING (MACHINING); INTERFACES (MATERIALS); MICROCRACKS; MICROSTRUCTURE; OPTIMIZATION; RESIDUAL STRESSES; SURFACE PHENOMENA; THERMAL EFFECTS;

CRACK MEASUREMENT; GRINDING INTERFACE; GRINDING VARIABLES; GROUND CERAMICS; MACHINING DAMAGE; SUBSURFACE DAMAGE;

STRUCTURAL CERAMICS;

EID: 0030080522     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-0136(95)02090-X     Document Type: Review

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