The effect of anisotropy on the deformation and fracture of sapphire wafers subjected to thermal shocks

Journal of Materials Processing Technology

Volumn 194, Issue 1-3, 2007, Pages 52-62

  Vodenitcharova, T ^a   Zhang, L C ^a   Zarudi, I ^a   Yin, Y ^b   Domyo, H ^c   Ho, T ^c   Sato, M ^c  

^a UNIVERSITY OF SYDNEY   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

^c Peregrine Semiconductor   (United States)

Author keywords

Anisotropy; Sapphire wafers; Thermal shock; Thermal stresses

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; STRESS CONCENTRATION; THERMAL SHOCK; THERMAL STRESS; ANISOTROPY; SAPPHIRE; TENSILE STRESS;

ANISOTROPIC MATERIALS; SAPPHIRE WAFERS; WAFER EDGES;

SAPPHIRE; SILICON WAFERS;

ANISOTROPIC MATERIALS; CLEAVAGE PLANE; SAPPHIRE WAFERS; WAFER EDGE;

EID: 34548583126     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.03.125     Document Type: Article

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