Optimization of the chemical mechanical polishing process for optical silicon substrates

International Journal of Advanced Manufacturing Technology

Volumn 60, Issue 9-12, 2012, Pages 1197-1206

  Zhong, Z W ^a   Tian, Y B ^b   Ang, Y J ^b   Wu, H ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Chemical mechanical polishing; Material removal rate; Micrometric flatness; Nanometric surface roughness; Optical silicon substrate

Indexed keywords

CHEMICAL-MECHANICAL POLISHING PROCESS; CMP PROCESS; KEY PROCESS; MATERIAL REMOVAL RATE; MICROMETRIC FLATNESS; NANOMETRICS; OPTIMAL COMBINATION; OPTIMAL PROCESS; POLISH PRESSURE; POLISHING TIME; ROTATIONAL SPEED; SILICON SUBSTRATES; SLURRY SUPPLY; SURFACE FINISHES;

DESIGN OF EXPERIMENTS; EXPERIMENTS; LITHOGRAPHY; OPTIMIZATION; SPEED; SURFACE ROUGHNESS;

CHEMICAL MECHANICAL POLISHING;

EID: 84861660352     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-011-3668-9     Document Type: Article

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