Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

International Journal of Advanced Manufacturing Technology

Volumn 38, Issue 7-8, 2008, Pages 674-682

  Liao, Hsin Te ^a   Shie, Jie Ren ^a   Yang, Yung Kuang ^a  

^a MINGHSIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

CMP; DOE; Optimization; Taguchi method

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; EXPERIMENTS; FEATURE EXTRACTION; FOOD PROCESSING; MATHEMATICAL MODELS; NANOTECHNOLOGY; OPTIMIZATION; POLISHING; PROCESS ENGINEERING; REGRESSION ANALYSIS; SPEED; SURFACES; TAGUCHI METHODS;

CHEMICAL-MECHANICAL POLISHING PROCESS; CMP; CMP PROCESSES; DESIGN OF EXPERIMENTS METHODS; DESIGNS OF EXPERIMENTS; DOE; MATERIAL REMOVAL RATE; NON UNIFORMITIES; O PTIMAL SETTING; OPTIMAL PARAMETERS; ORTHOGONAL ARRAYS; PLANNING OF EXPERIMENTS; PREDICTION MODELING; QUALITY TARGETS; REMOVAL RATE; SLURRY FLOW RATES; SURFACE PROFILING; SYSTEMATIC APPROACHES; TAGUCHI; TAGUCHI METHOD; WAFER MANUFACTURING;

DESIGN OF EXPERIMENTS;

EID: 49649110652     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-007-1124-7     Document Type: Article

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