Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography

Materials Characterization

Volumn 70, Issue , 2012, Pages 33-41

  Yazzie, K E ^a   Williams, J J ^a   Phillips, N C ^a   De Carlo, F ^b   Chawla, N ^a  

^a Arizona State University   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

3D materials science; Focused ion beam tomography; Pb free solder; X ray tomography

Indexed keywords

3D RECONSTRUCTION; COMPLEX MORPHOLOGY; ELECTRONIC PACKAGING; INTERCONNECTIVITY; LENGTH SCALE; MICRO-STRUCTURAL CHARACTERIZATION; MULTISCALES; PB FREE SOLDERS; PB-FREE; SN-0.7CU; SN-3.5AG; SN-37PB; SN-PB ALLOYS; SOLDER JOINTS; X-RAY SYNCHROTRON; X-RAY TOMOGRAPHY;

ALLOYS; CHARACTERIZATION; ELECTRONICS PACKAGING; FOCUSED ION BEAMS; LEAD; SOLDERING ALLOYS; THREE DIMENSIONAL; TIN ALLOYS; TOMOGRAPHY; X RAYS;

TIN;

EID: 84861546197     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2012.05.004     Document Type: Article

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