Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography

Materials Characterization

Volumn 62, Issue 10, 2011, Pages 970-975

  Jiang, Ling ^a   Chawla, Nikhilesh ^a   Pacheco, Mario ^b   Noveski, Vladimir ^b  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Pb free solder; Porosity; X ray tomography

Indexed keywords

HIGH RESOLUTION; LARGE PORES; MECHANICAL BEHAVIOR; MICRO-STRUCTURAL CHARACTERIZATION; PB FREE SOLDERS; SEGMENTATION TECHNIQUES; SOLDER JOINTS; SOLDER REFLOW; THREE DIMENSIONAL (3D) VISUALIZATION; THREE-DIMENSIONAL (3D); X-RAY TOMOGRAPHY;

IMAGING SYSTEMS; LEAD; MORPHOLOGY; PORE SIZE; SOLDERING; SOLDERING ALLOYS; THREE DIMENSIONAL; THREE DIMENSIONAL COMPUTER GRAPHICS; TOMOGRAPHY; VISUALIZATION; X RAYS;

TIN;

EID: 81155158525     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2011.07.011     Document Type: Article

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