Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

Journal of Applied Physics

Volumn 104, Issue 11, 2008, Pages

  Xu, Luhua ^a   Xu, Di ^a   Tu, K N ^a   Cai, Yuan ^b   Wang, Ning ^b   Dixit, Pradeep ^c   Pang, John H L ^c   Miao, Jianmin ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; IN SITU PROCESSING; THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

ATOMIC LAYERS; DOMINANT MECHANISMS; DRIVING FORCES; ELECTRICAL CONDUCTIVITIES; ELECTROPLATED COPPERS; HIGH DENSITIES; HIGH RESOLUTIONS; HIGH STRAINS; IN SITU TRANSMISSION ELECTRON MICROSCOPIES; NANOCRYSTALLINE COPPERS; NANOTWINS; STRUCTURE UNITS; THERMAL STABILITIES; TWIN BOUNDARIES; TWIN PLANES; YIELD STRENGTHS;

COPPER;

EID: 58149267504     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3035944     Document Type: Article

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