Interdiffusion, stress, and microstructure evolution during annealing in Co/Cu/Co trilayers

Journal of Applied Physics

Volumn 91, Issue 12, 2002, Pages 9696-9700

  Bruckner W ^a   Baunack, S ^a   Thomas, J ^a   Hecker, M ^a   Schneider, C M ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AFTER-HEAT TREATMENT; CONCENTRATION-DEPTH PROFILE; ELECTRICAL RESISTANCES; GIANT MAGNETORESISTANCE EFFECT; GRAIN MORPHOLOGIES; GRAIN-BOUNDARY DIFFUSION; HIGH TEMPERATURE; IN-SITU; MICROSCOPIC MECHANISMS; MICROSTRUCTURAL CHANGES; MICROSTRUCTURE EVOLUTIONS; NANOSCALE MULTILAYERS; TEMPERATURE RAMP; TEXTURE FORMATION; TRILAYERS;

ISOTHERMAL ANNEALING;

GRAIN GROWTH;

EID: 84861433717     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1479750     Document Type: Article

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