Apparatus for thin-film stress measurement with integrated four-point bending equipment: Performance and results on Cu films

Review of Scientific Instruments

Volumn 71, Issue 12, 2000, Pages 4479-4482

  Weihnacht, V ^a   Bruckner W ^a   Schneider, C M ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001127323     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1326925     Document Type: Article

References (14)

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