Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films

Journal of Materials Research

Volumn 14, Issue 4, 1999, Pages 1286-1294

  Bruckner W ^a   Pitschke, W ^a   Baunack, S ^a   Thomas, J ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ARGON; ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; COPPER COMPOUNDS; GRAIN BOUNDARIES; OXIDATION; SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; TEMPERATURE MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

STRESS EVOLUTION; STRESS TEMPERATURE MEASUREMENTS; TEMPERATURE COEFFICIENT OF RESISTANCE;

THIN FILMS;

EID: 0042553288     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1999.0175     Document Type: Article

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