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Volumn 92, Issue , 2012, Pages 86-90
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Titanium nitride as electrode for MOS technology and Schottky diode: Alternative extraction method of titanium nitride work function
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Author keywords
[No Author keywords available]
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Indexed keywords
C-V CURVE;
CAPACITANCE VOLTAGE;
CONVENTIONAL FURNACE;
CURRENT-VOLTAGE MEASUREMENTS;
DC SPUTTERING;
DEFECT INCORPORATION;
ELECTRICAL RESISTIVITY;
EXTRACTION METHOD;
FORMING GAS;
FOUR-PROBE;
FUNCTION EXTRACTION;
FUNCTION VALUES;
GATE ELECTRODES;
I - V CURVE;
IDEALITY FACTORS;
METAL OXIDE SEMICONDUCTOR;
MOS TECHNOLOGY;
PHASE FORMATIONS;
POLYCRYSTALLINE;
SCHOTTKY DEVICES;
SCHOTTKY DIODES;
SEMI-CONDUCTOR SURFACES;
SI SUBSTRATES;
SINTERING PROCESS;
TIN ELECTRODES;
TIN LAYERS;
DIELECTRIC DEVICES;
ELECTRIC CONDUCTIVITY;
ELECTRODES;
ELECTROLYTIC CAPACITORS;
FABRICATION;
GATE DIELECTRICS;
MOS CAPACITORS;
RAMAN SPECTROSCOPY;
SCHOTTKY BARRIER DIODES;
SILICON;
SILICON COMPOUNDS;
SINTERING;
SUBSTRATES;
SURFACE DEFECTS;
TINNING;
TITANIUM NITRIDE;
WORK FUNCTION;
X RAY DIFFRACTION;
SEMICONDUCTING SILICON;
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EID: 84858288213
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2011.04.059 Document Type: Conference Paper |
Times cited : (74)
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References (19)
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