Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

IET Circuits, Devices and Systems

Volumn 6, Issue 1, 2012, Pages 35-44

  Priyadarshi, S ^a   Harris, T R ^a   Melamed, S ^a   Otero, C ^b   Kriplani, N M ^a   Christoffersen, C E ^c   Manohar, R ^b   Dooley, S R ^d   Davis, W R ^a   Franzon, P D ^a   Steer, M B ^a  

^a North Carolina State University   (United States)

^b Computer Systems Laboratory ^*  (United States)

^c LAKEHEAD UNIVERSITY   (Canada)

^d AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN PHASE; ELECTRO-THERMAL SIMULATION; ELECTROTHERMAL MACROMODELS; FAST DYNAMICS; HIGH THERMAL; JUNCTION TEMPERATURES; LARGE-SCALE CIRCUITS; MACRO-MODELS; PHYSICS-BASED; STANDARD CELL; THERMAL TRANSIENTS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TRANSISTOR-LEVEL SIMULATION;

ELECTRIC BATTERIES; INTEGRATED CIRCUITS; THREE DIMENSIONAL; TRANSIENTS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84856921107     PISSN: 1751858X     EISSN: None     Source Type: Journal    
DOI: 10.1049/iet-cds.2011.0061     Document Type: Article

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